The AsiaWorld Expo, which is situated right next to Chek Lap Kok airport on Lantau Island, will be the venue for the packaging, ingredients and processing equipment from 15 – 17 November.
Meanwhile, industrial professionals wishing to also get an overview of what’s happening in the finish goods side of the business will have to make their over to the Hong Kong Convention & Exhibition Centre on Hong Kong Island from 6 – 18 November.
Two venues a short ride away
The two expo venues are under 20 minutes train ride away from one another, so it would be possible to even do the two venues on the same day, though there is a lot to see, given the total exhibition space of 98,000 square metres.
Indeed, the organiser says that the decision to split the two venues was taken on the back of the significant success of the 2015 event, when it also became evident that to expand this year’s event, more space would have to be found
Indeed, with the new bigger space in place, Cosmoprof organisers reported back in April of this year that 90% of the extended space for this year’s event had already been reserved, even though it is 17% bigger than last year.
Awards, trends, spotlights and Galleries
This year’s event promises a number of highlights and features, including trends and product platforms for the event in the Convention Centre, while platforms are also included for both packaging and ingredients at the Asia World Expo.
At the Hong Kong Island venue, the Discover Trends will be back, highlighting the latest product innovations across all beauty categories, while the Extraordinary Gallery will also serve to highlight the most eye-catching and innovative new product launches.
Ingredients and packaging will be platformed at the other event space, with the Spotlight on Ingredients area serving to highlight the most high tech and cutting edge ingredient launches, while the Innovation Circle Awards will highlight what is hot in packaging.
For more details about the event, both for potential exhibitors and visitors, please click here.